NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62739-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 62739-1 | 2013-06 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 62739-2 | 2016-07 | Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing More |
| IEC 60194 | 2015-04 | Printed board design, manufacture and assembly - Terms and definitions More |
