NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN IEC 60603-8 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 60097 | 1993-01 | Grid system for printed circuits (IEC 60097:1991) More |
| IEC 60097 | 1970 | Grid system for printed circuits More |
| IEC 60194 | 1988 | Terms and definition for printed circuits More |
| IEC 60326 | 1970 | General requirements and measuring methods for printed wiring boards More |
| IEC 60326-1 | 1984 | Printed boards. Part 1 : General information for the specification writer. More |
| IEC 60326-10 | 1991-02 | Printed boards; part 10: specification for flex-rigid double-sided printed boards with through connections More |
| IEC 60326-11 | 1991-02 | Printed boards; part 11: specification for flex-rigid multilayer printed boards with through connections More |
| IEC 60326-12 | 1992-07 | Printed boards; part 12: specification for mass lamination panels (semi-manufactured multilayer printed boards) More |
| IEC 60326-2 | 1976 | Printed boards. Part 2 : Test methods More |
| IEC 60326-2A | 1980 | Printed boards. Part 2 : Test methods. More |
