NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60352-5 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60194 | 1988 | Terms and definition for printed circuits More |
| IEC 60249-2-11 | 1987 | Base materials for printed circuits; part 2 : specifications; specification No. 11: thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards More |
| IEC 60249-2-11 AMD 2 | 1993-05 | Base materials for printed circuits; part 2: specifications; specification 11: thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards; amendment 2 More |
| IEC 60249-2-12 | 1987 | Base materials for printed circuits; part 2: specifications; specification No. 12: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, fur use in the fabrication of multilayer printed boards More |
| IEC 60249-2-12 AMD 2 | 1993-05 | Base materials for printed circuits; part 2: specifications; specification 12: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards; amendment 2 More |
| IEC 60249-2-4 | 1987 | Base materials for printed circuits; part 2: specifications; specification No. 4: epoxide woven glass fabric copper-clad laminated sheet, general purpose grade More |
| IEC 60326-3 | 1991-04 | Printed boards; part 3: design and use of printed boards More |
| IEC 60326-5 | 1980 | Printed boards. Part 5 : Specification for single and double sided printed boards with plated-through holes More |
| IEC 60326-6 | 1980 | Printed boards. Part 6 : Specification for multilayer printed boards More |
| IEC 60352-1 | 1983 | Solderless connections. Part 1 : Solderless wrapped connections - General requirements, test methods and practical guidance More |
