NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-4 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61340-5-1 | 2007-08 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC 61760-2 | 2007-04 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide More |
| IEC 60068-2-58 | 2004-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-78 | 2012-10 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state More |
| IEC 60417 | 1973 | Graphical symbols for use on equipment. Index, survey and compilation of the single sheets. More |
| IEC 60749-20-1 | 2009-04 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
| ISO 62 | 2008-02 | Plastics - Determination of water absorption More |
