NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60115-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| EN 60068-2-45 | 1992-08 | Environmental testing; part 2: test methods; test XA and guidance: immersion in cleaning solvents (IEC 60068-2-45:1980 + corrigendum:1981) More |
| EN 60068-2-54 | 2006-08 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method (IEC 60068-2-54:2006) More |
| EN 60068-2-58 | 2015-05 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2015) More |
| EN 60068-2-6 | 2008-02 | Environmental testing - Part 2-6: Tests - Tests Fc: Vibration (sinusoidal) (IEC 60068-2-6:2007) More |
| EN 60068-2-69 | 2007-06 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method (IEC 60068-2-69:2007) More |
| EN 60068-2-78 | 2013-06 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state (IEC 60068-2-78:2012) More |
| EN 60286-1 | 1998-02 | Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:1997) More |
| EN 60286-2 | 2015-06 | Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes (IEC 60286-2:2015) More |
| EN 60286-3 | 2013-08 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013) More |
| EN 60286-3/AC | 2013-10 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More |
