NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62878-1-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 62137-1-2 | 2007-07 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test More |
| IEC 62137-1-3 | 2008-11 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test More |
| IEC 62421 | 2007-08 | Electronics assembly technology - Electronic modules More |
| IEC/TR 62866 | 2014-05 | Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing More |
| IEC/TS 62878-2-1 | 2015-03 | Device embedded substrate - Part 2-1: Guidelines - General description of technology More |
| IEC/TS 62878-2-3 | 2015-03 | Device Embedded Substrate - Part 2-3: Guidelines - Design Guide More |
| ISO 21948 | 2001-04 | Coated abrasives - Plain sheets More |
