NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62878-1-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC/TS 62878-2-4 | 2015-03 | Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG) More |
| IEC 60068-2-1 | 2007-03 | Environmental testing - Part 2-1: Tests - Test A: Cold More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60194 | 2015-04 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-14 | 2009-01 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60068-2-21 | 2006-06 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices More |
| IEC 60068-2-30 | 2005-08 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) More |
