NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-58 ; VDE 0468-2-58:2016-01 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61760-1 | 2006-04 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More |
| DIN EN 60068-1 ; VDE 0468-1:2015-09 | 2015-09 | Environmental testing - Part 1: General and guidance (IEC 60068-1:2013); German version EN 60068-1:2014 More |
| DIN EN 61190-1-1 | 2003-01 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002 More |
| DIN EN 61190-1-2 | 2014-11 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014 More |
| DIN EN 61249-2-22 | 2005-08 | Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-22:2005); German version EN 61249-2-22:2005 More |
| DIN EN 61249-2-35 | 2009-07 | Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-35:2008); German version EN 61249-2-35:2009 More |
| IEC 60068-2-54 | 2006-04 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method More |
| IEC 60068-2-69 | 2007-05 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method More |
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61760-3 | 2010-03 | Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering More |
