NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 60068-2-58 ; VDE 0468-2-58:2016-01 [Withdrawn] references following documents:

Document number Edition Title
IEC 60068-2-20 2008-07 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More 
IEC 61190-1-2 2014-02 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More 
IEC 61190-1-3 2007-04 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More 
IEC 61190-1-3 AMD 1 2010-06 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications More 
IEC 60068-1 2013-10 Environmental testing - Part 1: General and guidance More 
IEC 60194 2006-02 Printed board design, manufacture and assembly - Terms and definitions More 
IEC 61190-1-1 2002-03 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More 
IEC 61191-2 2013-06 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies More 
IEC 61249-2-22 2005-01 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad More 
IEC 61249-2-35 2008-11 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials; clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly More