NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
| IEC 62137 | 2004-07 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN More |
| ISO 9001 | 2015-09 | Quality management systems - Requirements More |
| ISO 9455-2 | 1993-04 | Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method More |
