NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61189-5-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61190-1-2 | 2014-02 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
| IEC 61189-6 | 2006-07 | Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| ASTM D 1210 | 2005 | Standard Test Method for Fineness of Dispersion of Pigment-Vehicle Systems by Hegman-Type Gage More |
| IEC 60068-1 | 2013-10 | Environmental testing - Part 1: General and guidance More |
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61189-3 | 2007-10 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
