NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60068-2-21 | 2006-06 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices More |
| IEC 60068-2-27 | 2008-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock More |
| IEC 60068-2-44 | 1995-01 | Environmental testing - Part 2: Tests; Guidance on test T: Soldering More |
| IEC 60068-2-58 | 2015-03 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-6 | 2007-12 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) More |
| IEC 60068-2-78 | 2001-08 | Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state More |
| IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-20-1 | 2009-04 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
