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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 62137-4 [CURRENT] references following documents:

Document number Edition Title
IEC 62137-3 2011-11 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints More 
IEC 60068-2-14 2009-01 Environmental testing - Part 2-14: Tests - Test N: Change of temperature More 
IEC 60191-6-2 2001-12 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages More 
IEC 60191-6-5 2001-08 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) More 
IEC 60194 2015-04 Printed board design, manufacture and assembly - Terms and definitions More 
IEC 61190-1-3 2007-04 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More 
IEC 61249-2-7 2002-03 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More 
IEC 61249-2-8 2003-02 Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad; Modified brominated epoxide woven fiberglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad More 
IEC 60068-1 1988 Environmental testing. Part 1: General and guidance More 
IEC 60068-1 AMD 1 1992-05 Environmental testing; part 1: general and guidance; amendment 1 to IEC 60068-1:1988 More