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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62149-9 ; VDE 0886-149-9:2015-01 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60950-1 | 2005-12 | Information technology equipment - Safety - Part 1: General requirements More |
| IEC 61300-2-47 | 2010-10 | Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks More |
| DIN EN 60068-2-27 ; VDE 0468-2-27:2010-02 | 2010-02 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock (IEC 60068-2-27:2008); German version EN 60068-2-27:2009 More |
| DIN EN 60068-2-6 ; VDE 0468-2-6:2008-10 | 2008-10 | Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal) (IEC 60068-2-6:2007); German version EN 60068-2-6:2008 More |
| DIN EN 60191-3 | 2000-07 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999 More |
| DIN EN 60191-3 Beiblatt 1 | 2006-08 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms More |
| DIN EN 60191-6 | 2010-06 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 More |
| DIN EN 60191-6-1 | 2002-08 | Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001 More |
| DIN EN 60191-6-10 | 2004-05 | Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003 More |
| DIN EN 60191-6-12 | 2011-12 | Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011 More |
