NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-4 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides More |
| IEC 61188-5-5 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides More |
| IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
| IEC 61188-7 | 2009-05 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction More |
| IEC 61189-2 | 2006-05 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More |
| IEC 61193-1 | 2001-12 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More |
| IEC 61193-3 | 2013-01 | Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing More |
| IEC 62326-1 ; QC 230000:2002-03 | 2002-03 | Printed boards - Part 1: Generic specification More |
| IEC 62326-4 ; QC 230500:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More |
| IEC 62326-4-1 ; QC 230401:1996-12 | 1996-12 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C More |
