NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60286-3 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60191-2 | 1966 | Mechanical standardization of semiconductor devices. Part 2 : Dimensions More |
| IEC 61340-5-1 | 2007-08 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements More |
| IEC/TR 61340-5-2 | 2007-08 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide More |
| IEC 60286-3-1 | 2009-05 | Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes More |
| IEC 60286-3-2 | 2009-05 | Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width More |
| IEC/TR 62258-3 | 2010-08 | Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage More |
