NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 61193-3 [CURRENT] references following documents:

Document number Edition Title
IEC 60194 2006-02 Printed board design, manufacture and assembly - Terms and definitions More 
IEC 62326-4 ; QC 230500:1996-12 1996-12 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification More 
IEC 60068-2-20 2008-07 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More 
IEC 60068-2-3 1969 Basic environmental testing procedures. Part 2 : Tests. Test Ca: Damp heat, steady state More 
IEC 60068-2-38 2009-01 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test More 
IEC 61189-2 2006-05 Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures More 
IEC 61189-3 2007-10 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More 
IEC 61193-1 2001-12 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies More 
IEC 61193-2 2007-08 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages More 
IEC 61249-2-34 2009-02 Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad More