2. Getting involved
  3. Standards Committees
  4. DKE
NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

DIN IEC/TS 62647-1 ; DIN SPEC 42647-1:2013-07 references following documents:

Document number Edition Title
IEC 61192-4 2002-11 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies More 
IEC 61192-5 2007-05 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies More 
IEC/PAS 62647-21 2011-07 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics More 
IEC/PAS 62647-3 2011-07 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes More 
IPC 2225 ; ANSI/IPC-2225 1998-05 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies More 
IPC 6015 1998-02-01 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures More