NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN IEC/TS 62647-1 ; DIN SPEC 42647-1:2013-07 references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61190-1-1 | 2002-03 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly More |
| IEC 61190-1-2 | 2007-04 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61190-1-3 AMD 1 | 2010-06 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications More |
| IEC 61190-1-3 Edition 2.1 | 2010-11 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61191-1 | 1998-08 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies More |
| IEC 61192-1 | 2003-02 | Workmanship requirements for soldered electronic assemblies - Part 1: General More |
| IEC 61192-2 | 2003-03 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mounted assemblies More |
| IEC 61192-3 | 2002-12 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies More |
