NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-5 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides More |
| IEC 61188-5-6 | 2003-01 | Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides More |
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
| IEC 61249-2-7 | 2002-03 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad More |
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-14 | 2009-01 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60068-2-78 | 2001-08 | Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state More |
| IEC 61760-1 | 2006-04 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More |
| IEC 62137 | 2005-02 | Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN More |
