NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-3 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 62137-1-1 | 2007-07 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test More |
| IEC 62137-1-2 | 2007-07 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test More |
| IEC 62137-1-3 | 2008-11 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test More |
| IEC 62137-1-4 | 2009-01 | Surface mounting technology - Environmental and endurance test methods for surface-mount solder joints - Part 1-4: Cyclic bending test More |
| IEC 62137-1-5 | 2009-02 | Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test More |
| IEC 61188-5-1 | 2002-07 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations; Generic requirements More |
| IEC 61188-5-2 | 2003-06 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations; Discrete components More |
| IEC 61188-5-3 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides More |
| IEC 61188-5-4 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides More |
| IEC 61188-5-5 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides More |
