NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-83 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-20 | 2008-07 | Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads More |
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-58 | 2005-02 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60194 | 2006-02 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 60068-2-69 | 2007-05 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method More |
| IEC 61189-5 | 2006-08 | Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies More |
