NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-45 AMD 1 | 1993-02 | Basic environmental testing procedures; part 2: tests; test XA and guidance: immersion in cleaning solvents; amendment 1 More |
| IEC 60068-2-58 | 1989-08 | Environmental testing; part 2: tests; test td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-69 | 1995-12 | Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method More |
| IEC 60191-6 | 1990-12 | Mechanical standardization of semiconductor devices; part 6: general rules for the preparation of outline drawings of surface mounted semiconductor device packages More |
| IEC 60194 | 1988 | Terms and definition for printed circuits More |
| IEC 60249-2-4 | 1987 | Base materials for printed circuits; part 2: specifications; specification No. 4: epoxide woven glass fabric copper-clad laminated sheet, general purpose grade More |
| IEC 60249-2-4 AMD 2 | 1992-01 | Base materials for printed circuits; part 2: specifications; specification No. 4: epoxide woven glass fabric copper-clad laminated sheet, general purpose grade; amendment 2 More |
| IEC 60249-2-5 | 1987 | Base materials for printed circuits; part 2: specifications; specification No. 5: epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) More |
| IEC 60286-3 | 1991-02 | Packaging of components for automatic handling; part 3: packaging of leadless components on continuous tapes More |
| IEC 60286-4 | 1997-12 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G More |
