NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61191-2 | 1998-08 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies More |
| IEC 61191-3 | 1998-08 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 1998-08 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| IEC 61249-8-8 | 1997-06 | Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings More |
| IEC 61760-2 | 1998-02 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide More |
| IEC 62326-1 ; QC 230000:1996-11 | 1996-11 | Printed boards - Part 1: Generic specification More |