NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61191-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 101/19/CDV ; IEC 61340-5-2:1996-03 ; IEC-PN 101/61340-5-2:1996-03 | 1996-03 | Electrostatics - Part 5: Specification for the protection of electronic devices from electrostatic phenomena - Section 2: User guide More |
| IEC 52/629/CDV ; IEC 61249-8-1:1996-02 ; IEC-PN 52/1249-8-1:1996-02 | 1996-02 | IEC 1249-8-1: Materials for interconnection structures - Part 8: Sectional specification set for nonconductive films and coatings - Section 1: Adhesive coated flexible polyester film More |
| IEC 52/630/CDV ; IEC 61249-8-2:1996-02 ; IEC-PN 52/1249-8-2:1996-02 | 1996-02 | IEC 1249-8-2: Materials for interconnection structures - Part 8: Sectional specification set for nonconductive films and coatings - Section 2: Adhesive coated flexible polyimide film More |
| IEC 52/631/CDV ; IEC 61249-8-3:1996-02 ; IEC-PN 52/1249-8-3:1996-02 | 1996-02 | IEC 1249-8-3: Materials for interconnection structures - Part 8: Sectional specification set for nonconductive films and coatings - Section 3: Transfer adhesive film More |
| IEC 52/686/CDV ; IEC 61188-2:1996-12 ; IEC-PN 52/1188-2:1996-12 | 1996-12 | IEC 1188-2: Design and use of printed boards and printed board assemblies - Part 2: Guide to the use of printed wiring board substrate materials - Surface mount technology More |
| IEC 60050-541 | 1990-10 | International electrotechnical vocabulary; chapter 541: printed circuits More |
| IEC 60721-3-1 | 1987 | Classification of environmental conditions. Part 3: Classification of groups of environmental parameters and their severities. Storage. More |
| IEC 61188-1-1 | 1997-08 | Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies More |
| IEC 61189-1 | 1997-03 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology More |
| IEC 61189-3 | 1997-04 | Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) More |
