NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-3 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60286-3-1 | 2009-05 | Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes More |
| IEC 60286-3-2 | 2009-05 | Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width More |
| IEC 60286-4 | 1997-12 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G More |
| IEC 60286-5 | 2003-10 | Packaging of components for automatic handling - Part 5: Matrix trays More |
| IEC 60286-5 AMD 1 | 2009-02 | Packaging of components for automatic handling - Part 5: Matrix trays; Amendment 1 More |
| IEC 60286-5 Edition 2.1 | 2009-05 | Packaging of components for automatic handling - Part 5: Matrix trays More |
| IEC 60286-6 | 2004-02 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components More |
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 61760-2 | 2007-04 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide More |
| IEC 62090 | 2002-11 | Product package labels for electronic components using bar code and two-dimensional symbologies More |
