NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 62137-1-5 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
| IEC 61190-1-3 | 2007-04 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications More |
| IEC 61760-1 | 2006-04 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More |
| IEC 60068-2-21 | 2006-06 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices More |
| IEC 61188-5-8 | 2007-10 | Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) More |
