NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-20-1 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-20 | 2008-12 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-30 | 2005-01 | Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing More |
| IEC 60749-37 | 2008-01 | Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer More |
| IEC 60749-39 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components More |
