NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-20 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-2 | 2007-07 | Environmental testing - Part 2-2: Tests - Test B: Dry heat More |
| IEC 60068-2-66 | 1994-06 | Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) More |
| IEC 60068-2-78 | 2001-08 | Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state More |
| IEC 60194 | 2006-02 | Printed board design, manufacture and assembly - Terms and definitions More |
| IEC 61191-3 | 1998-08 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies More |
| IEC 61191-4 | 1998-08 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies More |
| IEC 60068-2-54 | 2006-04 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method More |
| IEC 60068-2-58 | 2005-02 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-69 | 2007-05 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method More |
