NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60539-1 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-58 | 2004-07 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60068-2-6 | 1995-03 | Environmental testing - Part 2: Tests - Test Fc: Vibration (sinusoidal) More |
| IEC 60068-2-69 | 2007-05 | Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method More |
| IEC 60068-2-78 | 2001-08 | Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state More |
| IEC 60027-1 | 1992-12 | Letter symbols to be used in electrical technology; part 1: general More |
| IEC 60050-0 | 1975 | International Electrotechnical Vocabulary General Index More |
| IEC 60050-101 | 1998-04 | International Electrotechnical Vocabulary - Part 101: Mathematics More |
| IEC 60050-102 | 2007-08 | International Electrotechnical Vocabulary - Part 102: Mathematics - General concepts and linear algebra More |
| IEC 60050-111 | 1996-07 | International Electrotechnical Vocabulary - Chapter 111: Physics and chemistry More |
| IEC 60050-111 AMD 1 | 2005-03 | Amendment 1 - International Electrotechnical Vocabulary - Part 111: Physics and chemistry More |
