NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60749-37 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-10 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock More |
| IEC 60749-20 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-20-1 | 2009-04 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat More |
