NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60603-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60097 | 1991-05 | Grid systems for printed circuits More |
| IEC 60194 | 1988 | Terms and definition for printed circuits More |
| IEC 60326-3 | 1991-04 | Printed boards; part 3: design and use of printed boards More |
| IEC 60352-1 | 1983 | Solderless connections. Part 1 : Solderless wrapped connections - General requirements, test methods and practical guidance More |
| IEC 60352-4 | 1994-08 | Solderless connections - Part 4: Solderless non-accessible insulation displacement connections - General requirements, test methods and practical guidance More |
| IEC 60410 | 1973 | Sampling plans and procedures for inspection by attributes More |
| IEC 60512-1 | 1994-09 | Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General More |
| IEC 60512-2 | 1985 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 2 : General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests More |
| IEC 60512-2 AMD 1 | 1994-08 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 2: General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests; Amendment 1 More |
| IEC 60512-3 | 1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3 : Current-carrying capacity tests More |
