NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61188-5-4 [CURRENT] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-2-58 | 2005-02 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 60286-3 | 2007-06 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More |
| IEC 60286-4 | 1997-12 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G More |
| IEC 60286-5 | 2003-10 | Packaging of components for automatic handling - Part 5: Matrix trays More |
| IEC 61760-1 | 2006-04 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More |
| IEC 60191-2 | 1966 | Mechanical standardization of semiconductor devices. Part 2 : Dimensions More |
| IEC 60191-2 AMD 1 | 2001-03 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 1 More |
| IEC 60191-2 AMD 10 | 2004-03 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 10 More |
| IEC 60191-2 AMD 11 | 2004-11 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 11 More |
| IEC 60191-2 AMD 12 | 2006-03 | Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 12 More |
