NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 60068-2-82 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60068-1 | 1988 | Environmental testing. Part 1: General and guidance More |
| IEC 60068-2-20 | 1979 | Environmental testing. Part 2: Tests. Test T: Soldering More |
| IEC 60068-2-58 | 2005-02 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More |
| IEC 61192-3 | 2002-12 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies More |
| IEC 61760-1 | 2006-04 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) More |
| IEC 60068-2-14 | 1984 | Basic environmental testing procedures. Part 2 : Tests. Test N: Change of temperature More |
| IEC 60068-2-78 | 2001-08 | Environmental testing - Part 2-78: Tests; Test Cab: Damp heat, steady state More |
| IEC 60068-3-4 | 2001-08 | Environmental testing - Part 3-4: Supporting documentation and guidance; Damp heat tests More |
| IEC 61193-2 | 2007-08 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages More |
