NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-5 | 2003-01 | Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test More |
| IEC 60749-6 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More |
| IEC 60749-6 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature More |
| IEC 60749-7 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
| IEC 60749-7 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases More |
| IEC 60749-8 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 1 | 2003-04 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-8 Corrigendum 2 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing More |
| IEC 60749-9 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking More |
| IEC 60749-9 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking More |
