NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-31 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced) More |
| IEC 60749-32 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-32 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced) More |
| IEC 60749-33 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave More |
| IEC 60749-34 | 2005-11 | Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling More |
| IEC 60749-35 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components More |
| IEC 60749-36 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state More |
| IEC 60749-39 | 2006-07 | Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components More |
| IEC 60749-4 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More |
| IEC 60749-4 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) More |
