NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60749-17 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation More |
| IEC 60749-18 | 2002-12 | Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) More |
| IEC 60749-19 | 2003-02 | Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test More |
| IEC 60749-2 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-2 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure More |
| IEC 60749-20 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-20 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat More |
| IEC 60749-21 | 2005-10 | Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability More |
| IEC 60749-22 | 2002-09 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
| IEC 60749-22 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength More |
