NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
DIN EN 61760-2 [Withdrawn] references following documents:
| Document number | Edition | Title |
|---|---|---|
| IEC 60286-3 | 2007-06 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More |
| IEC 60286-4 | 1997-12 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G More |
| IEC 60286-5 | 2003-10 | Packaging of components for automatic handling - Part 5: Matrix trays More |
| IEC 60286-6 | 2004-02 | Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components More |
| IEC 60721-3-1 | 1997-02 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 1: Storage More |
| IEC 60721-3-2 | 1997-03 | Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Section 2: Transportation More |
| IEC 60749-1 | 2002-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-1 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 1: General More |
| IEC 60749-10 | 2002-04 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock More |
| IEC 60749-10 Corrigendum 1 | 2003-08 | Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock More |
