NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Materials for circuit boards and other interconnecting structures - Part 3-8: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
Abstract
This part of IEC 61249 specifies the classification, composition and materials, property requirements, quality assurance, packaging, marking, transport, storage and ordering information of build-up film for rigid organic package substrate (hereinafter referred to as build-up film). This part of IEC 61249 applicable to the design, manufacture, shipment monitoring, incoming inspection for downstream users of build-up film, etc.
Begin
2026-09-25
Planned document number
DIN EN IEC 61249-3-8
Project number
02234168
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
