NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate
Abstract
This standard applies to semiconductor packages and their package substrates that are assembled using package substrates. This test is not intended for reliability evaluation of semiconductor products itself. It is used to indicate the relative reliability performance of the package substrate applied to semiconductor products. Threshold values should be set individually depending on the application and usage environment as to whether or not the product is adopted in actual products.
Begin
2026-02-11
Planned document number
DIN EN IEC 63546-1
Project number
02233713
