NA 022
DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE
Project
Device embedding assembly technology - Part 2-604:Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module
Abstract
This document specifies the experimental evaluation method of heat transfer for stacked electronic module using the evaluation vehicle.
Begin
2025-05-22
Planned document number
DIN EN IEC 62878-2-604
Project number
02233162
Responsible national committee
DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen
