NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Projects of NA 022

Number: 8,457

Document number Begin Title Comment
DIN EN IEC 60286-3 2026-04-29 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes More  Comment 
DIN EN IEC 61754-13 Berichtigung 1 2026-04-29 Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 13: Type FC-PC connector family (IEC 61754-13:2024/COR1:2025); German version EN IEC 61754-13:2024/AC:2025-06 More  Comment 
DIN EN IEC 60704-2-22 2026-04-28 Household and similar electrical appliances - Test code for the determination of airborne acoustical noise - Part 2-22: Particular requirements for electrically operated spray seats More  Comment 
DIN EN 300392-3-9 2026-04-28 Terrestrial Trunked Radio (TETRA) - Voice plus Data (V+D) - Part 3: Interworking at the Inter-System Interface (ISI) - Sub-part 9: Transport layer independent, General design More  Comment 
DIN EN 300392-3-15 2026-04-28 Terrestrial Trunked Radio (TETRA) - Voice plus Data (V+D) - Part 3: Interworking at the Inter-System Interface (ISI) - Sub-part 15: Transport layer independent Additional Network Feature, Mobility Management (ANF-ISIMM) More  Comment 
DIN EN IEC 61853-3 2026-04-28 Photovoltaic (PV) module performance testing and energy rating - Part 3: Energy rating of PV modules (IEC 61853-3:2018) More  Comment 
DIN EN 300338-1 2026-04-28 Technical characteristics and methods of measurement for equipment for generation, transmission and reception of Digital Selective Calling (DSC) in the maritime MF, MF/HF and/or VHF mobile service - Part 1: Common requirements More  Comment 
DIN VDE 0105-100 2026-04-28 Operation of electrical installations - Part 100: General requirements More  Comment 
DIN EN IEC 63686 2026-04-23 Management systems - Guidelines for incorporating ecodesign in the medical device sector More  Comment 
DIN EN IEC 63551-3 2026-04-23 Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 3: Thermal imagers More  Comment 

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