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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

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Projects of NA 022

Number: 8,427

IEC 49/810/DC 2008-09-05 Proposal to revise the title and the scope of TC 49 More  Comment 
IEC 34B/1412/CD 2008-09-05 IEC 60061: Lamp caps and holders together with gauges for the control of interchangeability and safety Part 1: Lamp caps Part 2: Lampholders Part 3: Gauges Proposal for introduction of new G28d fits More  Comment 
IEC 86A/1373/CD 2008-09-05 IEC 60794-4-20 Ed. 1.0: Optical fibre cables -- Part 4-20: Aerial optical cables along electrical power lines - Family specification for ADSS (All Dielectric Self Supported) Optical cables More  Comment 
IEC 108/307/DC 2008-07-18 Draft Strategic Policy Statement More  Comment 
IEC 108/311A/DC 2008-08-29 Proposal from TC108/HBSDT to modify IEC 62368, Annex M, by adding requirements for the use of lithium-ion batteries More  Comment 
IEC 34A/1296/DC 2008-08-29 Proposal to amend IEC 60081: Double-capped fluorescent lamps - Performance specifications More  Comment 
IEC 15/515/CDV 2008-08-29 IEC 60674-3-8 Ed. 1.0: Specification for plastic films for electrical purposes - Part 3: Specifications for individual materials - Sheet 8: Requirements for balanced biaxially oriented polyethylenenaphthalate (PEN) films used for electrical insulation More  Comment 
IEC 91/805/NP 2008-08-29 Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull) More  Comment 
IEC 91/806/NP 2008-08-29 Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz) More  Comment 
IEC 91/807/NP 2008-08-29 Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz) More  Comment 

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