NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Projects of NA 022

Number: 8,409

Document number Begin Title Comment
IEC 64/1707/DC 2009-10-30 Call for comments on the maintenance of IEC 61200-52, 1993: Electrical installation guide - Part 52: Selection and erection of electrical equipment - Wiring systems More  Comment 
IEC 64/1708/DC 2009-10-30 Modification of the INTRODUCTION common to all Part 7XX of IEC 60364 More  Comment 
IEC 47F/38/NP 2009-10-30 (Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip More  Comment 
IEC 47F/39/NP 2009-10-30 (Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement More  Comment 
IEC 77B/620/NP 2009-10-30 New Work Item Proposal on Proposal for broadband immunity test for AC mains ports More  Comment 
IEC 86B/3440/CD 2009-10-23 IEC 62005-9-1/Ed1: Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components More  Comment 
IEC 34D/942/DC 2009-10-23 IEC 60598-1: Insulation of control interface More  Comment 
IEC 47D/829/FDIS 2009-10-23 IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) More  Comment 
IEC 77/418/CD 2009-10-23 IEC 61000-6-7: Electromagnetic compatibility (EMC) - Part 6-7: Generic standards - Immunity requirements for systems, equipment and products intended to perform functions in a safety-related system (functional safety) in industrial environments More  Comment 
IEC 86B/3108/CD 2009-10-23 IEC 61300-2-52 Ed.1.0: Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-52: Tests - Bending test for terminated cable assemblies More  Comment 

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