2. Getting involved
  3. Standards Committees
  4. DKE
NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Search list

Projects of NA 022

Number: 8,485

IEC 100/2052/CDV 2012-09-14 IEC 61937-6 Ed.2.0 Amd.1: Digital audio - Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 - Part 6: Non-linear PCM bitstreams according to the MPEG-2 AAC and MPEG-4 AAC audio formats (TA 4) More  Comment 
IEC 23A/668/CDV 2012-09-14 IEC 62275 Ed. 2: Cable management systems - Cable ties for electrical installations More  Comment 
IEC 49/1007/CD 2012-09-14 IEC 62604-1 Ed.1: Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification More  Comment 
IEC 44/676/CD 2012-08-31 IEC 60204-1 Ed 6: Safety of machinery - Electrical equipment of machines - Part 1: General requirements More  Comment 
IEC 86C/1114/CDV 2012-08-31 IEC 61280-4-2/Ed2: Fibre-optic communication subsystem test procedures - Part 4-2: Installed cable plant- Single-mode attenuation and optical return loss measurement More  Comment 
IEC 9/1730/CD 2012-08-31 IEC 60310 Ed.4: Railway applications - Traction transformers and inductors on board rolling stock More  Comment 
IEC 100/2051/CDV 2012-08-31 IEC 61883-8/Ed.1 Amd.1: Consumer audio/video equipment - Digital interface - Part 8: Transmission of ITU-R BT.601 style digital video data (TA 4) More  Comment 
IEC 100/2050/CDV 2012-08-31 IEC 62379-5-2 Ed.1.0: Common control interface for networked digital audio and video products - Part 5-2: Transmission over networks - Signalling (TA 4) More  Comment 
IEC 34C/1027/CD 2012-08-31 IEC 62756-1 Ed.1: Digital load side transmission lighting control - Part 1: Basic requirements More  Comment 
IEC 91/1047/CD 2012-08-24 IEC 60068-2-58 Ed.4: Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) More  Comment 

TOP