• Hydrogen Technologies Standards form the basic framework for market ramp-up

    More information

  • Climate change Standards and specifications support climate targets

    More information

  • Smart Farming Standards and specifications are drivers for the digitalization of agriculture

    More information
 

Projects of DKE/UK 631.4

IEC 47D/787/CD 2010-11-19 IEC 60191-2/f66 Ed.1: Proposed new package outline - large power package with 4 load terminals, P-UMP-A4. To be published as outline 184B, if approved. More  Comment 
IEC 47D/817A/CDV 2010-11-19 IEC 60191-2 f67 Ed.1: Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved. More  Comment 
IEC 47D/818/CDV 2010-11-19 IEC 60191-2 f68 Ed.1: Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F, if approved. More  Comment 
IEC 47D/819/CDV 2010-11-19 IEC 60191-2 f69 Ed.1: Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved. More  Comment 
IEC 47D/782/NP 2010-08-27 (Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) More  Comment 
IEC 47D/773/DC 2010-06-11 Maintenance - call for comments/ proposals on publications coming up for review and a call for experts More  Comment 
IEC 47D/803/CDV 2010-04-30 IEC 60191-4 Ed. 3: Mechanical Standardization Of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages More  Comment 
IEC 47D/804/CDV 2010-04-30 IEC 60191-6-1 Ed.2: Mechanical Standardization Of Semiconductor Devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals More  Comment 
IEC 47D/784/CDV 2010-01-08 IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) More  Comment 
IEC 47D/829/FDIS 2009-10-23 IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) More  Comment 

TOP