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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Draft standard [Pre-order]

DIN EN IEC 60749-22-1
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods (IEC 60749-22-1:2025); German version EN IEC 60749-22-1:2026

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 22: Kontaktfestigkeit - Drahtbond-Zugprüfverfahren (IEC 60749-22-1:2025); Deutsche Fassung EN IEC 60749-22-1:2026

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Edition 2026-11
Publication 2026-10-16
Public enquiry period 2026-10-16
until
2026-12-16
Original language German
Price from 179.40 €
Order from DIN Media
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