Attention: Your browser doesn't support javascript or you have deactivated Javascript in your browser. Please enable Javascript in your browser in order to be able to use all functions of this website.

NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Draft standard [Withdrawn]

DIN EN IEC 62878-2-602
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English

Title (German)

Montageverfahren für eingebettete Bauteile - Teil 2-602: Leitfaden für gestapelte Elektronikmodule - Verfahren zur Beurteilung der elektrischen Verbindungsfähigkeit zwischen den Modulen (IEC 91/1629/CD:2019); Text Deutsch und Englisch

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2020-11

Original language German , English

Price from 70.50 €

Order from DIN Media

Table of contents

Contact

Daniel Failer

Merianstraße 28
63069 Offenbach am Main

Send message to contact

Economic benefits

DIN SPEC

Why do standards cost money?

Get involved in standardization

Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN IEC 62878-2-602 Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English

Responsible national committee

Daniel Failer

DIN EN IEC 62878-2-602
Device Embedding Assembly Technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 91/1629/CD:2019); Text in German and English