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DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

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Draft standard [Withdrawn]

DIN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 47/2575/CDV:2019); German and English version prEN IEC 60749-15:2019

Title (German)

Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 47/2575/CDV:2019); Deutsche und Englische Fassung prEN IEC 60749-15:2019

Responsible national committee

DKE/K 631 - Halbleiterbauelemente  

Edition 2019-12
Original language German , English
Price from 63.80 €
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Table of contents

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