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NA 022

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

About DKE Projects Drafts Publications Documents withdrawn without replacement National committees European committees International committees

Draft standard [Withdrawn]

DIN EN 61191-3
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)

Title (German)

Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Durchsteckmontage (IEC 91/1300/CD:2015)

Responsible national committee

DKE/K 682 - Aufbau- und Verbindungstechnik für elektronische Baugruppen

Edition 2016-01

Original language German , English

Price from 106.30 €

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Table of contents

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Daniel Failer

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Terminology

DKE German Commission for Electrical, Electronic & Information Technologies of DIN and VDE

DIN EN 61191-3 Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)

Responsible national committee

Daniel Failer

DIN EN 61191-3
Printed Board Assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 91/1300/CD:2015)